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2010年5月13日星期四

Defects during the process of ERW Pipe material

As the number of computer chip in the circuit increase, its heat-generating distribution is becoming increasingly difficult. For example, host and large-scale computing and erw pipe heat flow has reached 100W/cm2, 2007 has reached 160W/cm2.

In addition to restrictions on the maximum chip temperature, the temperature uniformity was also a high demand, and therefore thermal characteristics of electronic product development, technology development is very important and direct impact on the final product cost and reliability. Heat pipe can be directly installed in the bottom surface of electronic chip that micro heat pipe into the internal part of the electronic chip directly to the heat removed from the largest thermal area. Hot dipped galvanized pipe can be used for cooling turbine impeller leading edge of the stator, and the phase transition by increasing the efficiency of the thermal conductivity of metal to cool space radiator panel. Cotter first proposed the concept of hot dipped galvanized pipe.

erw pipe is defined as the average curvature of liquid-gas interface and liquid in the number of the total flow of hydraulic radius of the bottom section of a heat pipe fairly typical micro heat pipe are convex, circular, triangular, square, hydraulic radius of 10 ~ 500μm.

For small heat pipe, the minimum cross-sectional area for the 1mm of magnitude as the size of this heat pipe is not small, so the difference between conventional heat pipe is not very clear.

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